Forget iPhone 17 rumors; let’s talk about the iPhone 18. Apple’s A20 chip in the 2026 lineup will be packaged with TSMC’s Wafer-Level Multi-Chip Module (WMCM) technology, according to analyst Ming-Chi Kuo.
“In 2H26, the iPhone 18’s A20 processor packaging will shift from InFO to WMCM (Wafer-level Multi-Chip Module). WMCM uses MUF (Molding Underfill), which integrates underfill and molding processes, reducing material consumption and process steps to improve yield and efficiency,” he says in a research note.
Other rumors about next year’s smartphones:
° Apple will stick with 6.3-inch and 6.9-inch displays (rounded up) for 2027’s iPhone 18 Pro and iPhone 18 Pro Max, respectively. However, there will reportedly be revisions to the screens. Apple will move the scanning technology for Face ID under the display, and leave just a pinhole for the front-facing camera as the only obstruction to the on-screen content.
° They’ll have displays that use less battery power than current models.
° The the iPhone 18 Pro, iPhone 18 Pro Max, and so-called iPhone 18 Fold will be equipped with Apple’s A20 chip.
° They’ll have under-screen Face ID.
° They will have a major leap in memory performance.
° They will have A20 chips manufactured with TSMC’s 2nm process.
° They will sport the C2 modem, a follow-up to Apple’s C1 modem.
° They will pack a 3nm A20 processor updated for Apple Intelligence.
