In an X post, analyst Ross Young reiterated rumors that 2026’s iPhone 18 Pro models will have under-screen Face ID.
From his post: “At the SID Business Conference today, OTI Lumionics CEO Michael Helander confirmed that they expect phones with under panel Face ID using their materials to be available for sale in 2026. This suggests that iPhone 18 Pro models will have under panel Face ID with other brands and models to follow.”
Other rumors about next year’s smartphones:
° They will have a major leap in memory performance.
° They will have A20 chips manufactured with TSMC’s 2nm process.
° They will sport the C2 modem, a follow-up to Apple’s C1 modem.
° They will pack a 3nm A20 processor updated for Apple Intelligence.
° Apple’s A20 chip in iPhone 18 models will switch from the previous InFo (Integrated Fan-Out) packaging to WMCM (Wafer-Level Multi-Chip Module) packaging.
