iPhones won’t adopt resin coated copper (RCC) foil for their printed circuit boards until 2025, according to a Medium post by analyst Ming-Chi Kuo.
“RCC can reduce the thickness of the mainboard (i.e., it can save internal space) and make the drilling process easier because it’s fiberglass-free,” Kuo says. “However, RCC will not be adopted in the 2024 iPhone 16 due to its fragile characteristics and inability to pass drop tests.”
Currently, Ajinomoto is the leading supplier of RCC material. If Apple and Ajinomoto can improve the RCC material before the third quarter of 2024, the 2025 new high-end iPhone 17 models will use it, Kuo says.
