Next year’s base iPhone 18 may pack 50% more memory than the base iPhone 17

Next year’s iPhone 18 could feature 50% more memory than the iPhone 17, according to Korea’s The Bell.

With the iPhone Air, iPhone 17, iPhone 17 Pro, and iPhone 17 Max Apple packed 12GB of unified memory. That’s 50% more than its predecessors. However, the base iPhone 17 stayed with 8GB of unified memory. Apparently this might change with the base iPhone 18 model.

Speaking of the iPhone 18, there will be two versions of the A20 chip for the iPhone 18 series, according to a post on the Chinese Weibo account. “The general version is called Borneo, and the Pro version and the processor for folding machines are Bornea Ultra,” the post adds.

What’s more, Apple will install a variable camera in next year’s iPhone 18 , according to the Korean site ETNews.

The variable light is a technology that adjusts the amount of light by adjusting the aperture, and is used when taking photos by changing the brightness and depth. This would be the first time that a variable tregulator has been applied to the iPhone.

ETNews claims the iPhone 18 series will implement a variable device for the main cameras of the high end iPhone 17 Pro and iPhone 17 Pro Max. There’s a rumor that we won’t see an iPhone 18 until 2027 as Apple will concentrate on a foldable iPhone next year. But here’s a roundup of the rumors about the iPhone 18 line-up whenever it arrives:

° Apple is working to simplify the Camera Control button component to reduce costs.

° Apple will stick with 6.3-inch and 6.9-inch displays (rounded up) for 2027’s iPhone 18 Pro and iPhone 18 Pro Max, respectively.

° The iPhone 18 models will have displays that use less battery power than current models. 

° The iPhone 18 Pro, iPhone 18 Pro Max, and so-called iPhone 18 Fold will be equipped with Apple’s A20 chip.

° They’ll have under-screen Face ID.

° They will have a major leap in memory performance.

° They will have A20 chips manufactured with TSMC’s 2nm process.

° They will sport the C2 modem, a follow-up to Apple’s C1 modem. 

° They will pack a 3nm A20 processor updated for Apple Intelligence.

° Apple’s A20 chip in iPhone 18 models will switch from the previous InFo (Integrated Fan-Out) packaging to WMCM (Wafer-Level Multi-Chip Module) packaging.

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