There will be two versions of the A20 chip for the iPhone 18 series, according to a post on the Chinese Weibo account.
“ The general version is called Borneo, and the Pro version and the processor for folding machines are Bornea Ultra,” the post adds.
Speaking of Apple’s A20 chip, the processor in the 2026 lineup will be packaged with TSMC’s Wafer-Level Multi-Chip Module (WMCM) technology, according to analyst Ming-Chi Kuo.
“In 2H26, the iPhone 18’s A20 processor packaging will shift from InFO to WMCM (Wafer-level Multi-Chip Module). WMCM uses MUF (Molding Underfill), which integrates underfill and molding processes, reducing material consumption and process steps to improve yield and efficiency,” he says in a research note.
A20 Chip is costly because of 2nm process so having two versions makes sense. One for normal work and the other for more performance work.