Samsung will supply Apple with advanced image sensors for the iPhone in Austin, Texas, according to The Elec.
From the report: Last week, the South Korean tech giant has place job postings for mechanical and electrical project managers to work on hookup at the fab.
Hookup is done to build pipelines for utilities such as gas and water that will be used at facilities. Managers for this handles opinions of designers, suppliers and equipment engineers.
The hiring post also means the foundation work for the cleanroom is wrapping up. Equipment are placed after hookup is completed.
Samsung is also hiring technicians and engineers for cleaning equipment, which are used to clean the surface of silicon wafers.
The iPhone 18 will almost certainly arrive in the last half of 2026. Here are some of the rumors about the iPhone 18 line-up:
° Apple is testing under-screen Face ID for next year’s iPhone 18 Pro models using a special “spliced micro-transparent glass” window built into the display.
° The iPhone 18 Pro Max may be the heaviest iPhone yet.
° The iPhone 18 Pro could drop the current two-tone look of the rear casing found on the iPhone 17 Pro in favor of a more seamless aesthetic.
° All flagship models will be equipped with a 24-megapixel front facing camera, up from 18 megapixels on iPhone 17 models,
° They’ll have variable aperture lenses, and the main and telephoto lens will feature a larger aperture.
° The base model may pack 50% more memory than the base model of the iPhone 17.
° Apple is working to simplify the Camera Control button component to reduce costs.
° Apple will stick with 6.3-inch and 6.9-inch displays (rounded up) for 2027’s iPhone 18 Pro and iPhone 18 Pro Max, respectively.
° The iPhone 18 models will have displays that use less battery power than current models.
° The iPhone 18 Pro, iPhone 18 Pro Max, and so-called iPhone 18 Fold will be equipped with Apple’s A20 chip.
° They will have a major leap in memory performance.
° They will have A20 chips manufactured with TSMC’s 2nm process.
° They will sport the C2 modem, a follow-up to Apple’s C1 modem.
° They will pack a 3nm A20 processor updated for Apple Intelligence.
° Apple’s A20 chip in iPhone 18 models will switch from the previous InFo (Integrated Fan-Out) packaging to WMCM (Wafer-Level Multi-Chip Module) packaging.
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