Sunday, August 24, 2025
iPhoneRumors

Rumor: Apple ISN’T removing the Camera Control button from the iPhone 18

iPhone 18 Pro concept courtesy of ECT Gadget

Apple ISN’T removing the Camera Control button from the iPhone 18, but is working to simplify the component to reduce costs, according to Weibo leaker Instant Digital.

From his X post: At present, the pressure-sensitive module of the iPhone 18 series is in normal trial production and sampling, but in order to reduce costs, the capacitor (currently capacitor + pressure sensor) has been removed, and all functions are realized with pure pressure sensor, similar to the scheme of OPPO X8 Ultra and vivo X200 Ultra, only Using pressure sensing, light touch, re-press and slide operations can be realized.

The current cost of Apple iPhone is really too expensive, and the after-sales service after it reaches the user’s hands is also expensive. Of course, there is also the reason why Apple’s intelligent and visual AI functions have not been introduced. The value of this button has not been brought into play, resulting in a lot of internal cost pressure. 

About the iPhone 18

There’s a rumor that we won’t see an iPhone 18 until 2027 as Apple will concentrate on a foldable iPhone next year. But here’s a roundup of the rumors about the iPhone 18 line-up whenever it arrives:

° Apple will stick with 6.3-inch and 6.9-inch displays (rounded up) for 2027’s iPhone 18 Pro and iPhone 18 Pro Max, respectively.

° The iPhone 18 models will have displays that use less battery power than current models. 

° The iPhone 18 Pro, iPhone 18 Pro Max, and so-called iPhone 18 Fold will be equipped with Apple’s A20 chip.

° They’ll have under-screen Face ID.

° They will have a major leap in memory performance.

° They will have A20 chips manufactured with TSMC’s 2nm process.

° They will sport the C2 modem, a follow-up to Apple’s C1 modem. 

° They will pack a 3nm A20 processor updated for Apple Intelligence.

° Apple’s A20 chip in iPhone 18 models will switch from the previous InFo (Integrated Fan-Out) packaging to WMCM (Wafer-Level Multi-Chip Module) packaging.

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Dennis Sellers
the authorDennis Sellers
Dennis Sellers is the editor/publisher of Apple World Today. He’s been an “Apple journalist” since 1995 (starting with the first big Apple news site, MacCentral). He loves to read, run, play sports, and watch movies.