Apple’s upcoming iPhone 17 Pro and iPhone 17 Pro Max models are rumored to be equipped with a vapor chamber cooling system, and the leaker known as Majin Bu today shared a photo of an alleged copper thermal plate for the system.
“According to an internal source, new confidential information is emerging about the iPhone 17 Pro, revealing Apple’s efforts to enhance heat management,” Bu says. “Central to these developments is the introduction of a vapor chamber (VC) cooling system, a first for the iPhone lineup. While this represents a significant step in thermal engineering, early indications suggest a design still evolving, with some challenges to address.”
As noted by Radian, vapor chamber cooling is a highly efficient thermal management solution used in electronic devices and high-performance computers to dissipate heat generated by the components. It is a flat, sealed chamber filled with a small amount of liquid (de-ionized water) that evaporates when exposed to heat. The vaporized liquid then spreads out evenly across the chamber, transferring heat away from the source and towards the outer edges where it can be dissipated more effectively.
