In a research note — as noticed by MacRumors — analyst Jeff said that he expects the iPhone 18 Pro, iPhone 18 Pro Max, and so-called iPhone 18 Fold to be equipped with Apple’s A20 chip.
He thinks the chip will have some key design changes over the A18 and upcoming A19 chips. Pu reiterated that the A20 chip will be manufactured with TSMC’s 2nm process. The current A18 Pro chip in iPhone 16 Pro models is fabricated with TSMC’s second-generation 3nm process.
Other rumors about next year’s smartphones:
° They’ll have under-screen Face ID.
° They will have a major leap in memory performance.
° They will have A20 chips manufactured with TSMC’s 2nm process.
° They will sport the C2 modem, a follow-up to Apple’s C1 modem.
° They will pack a 3nm A20 processor updated for Apple Intelligence.
° Apple’s A20 chip in iPhone 18 models will switch from the previous InFo (Integrated Fan-Out) packaging to WMCM (Wafer-Level Multi-Chip Module) packaging.
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