Apple is considering using a new method over PoP (package-on-package) for phones in 2026 due to on-AI demand, according to The Elec.
The article says Samsung has started research to change the packaging method for the low-power double data rate DRAM used in iPhones. The South Korean tech giant’s attempt to change the integrated circuit (IC) of the LPDDR to discrete package is per Apple’s request, according to The Elec.
This means the LPDDR will be packaged separately from the system semiconductor. Currently, the LPDDR is stacked and packaged on top of the system chip. Cupertino is planning to apply the change starting in 2026. The Elec says Apple plans on making the change in 2026.
