Forget iPhone 17 rumors. Let’s look ahead to 2026’s iPhone 18. They’ll purportedly use TSMC’s next-generation 2-nanometer fabrication process in combination with a new packaging method that will integrate 12GB of RAM.
In a Weibo post, Chinese-language user “Phone Chip Expert” said Apple’s A20 chip in iPhone 18 models will switch from the previous InFo (Integrated Fan-Out) packaging to WMCM (Wafer-Level Multi-Chip Module) packaging, while memory will be upgraded to 12GB.
The result should be an iPhone with more RAM and more speed while running cooler.
