Apple has been granted a patent (number 10,771,876) for “headphones with acoustically split cushions” that hint at features of the rumored “AirPods Studio.” The over-the-ear headphones are expected to be released before the holidays and be targeted to audiophiles.
In Apple’s patents, headphones are disclosed that include a first earcup assembly and a second earcup assembly. The headphones include a headband extending between the first and second earcup assemblies. The headband includes opposing ends attached to the first and second earcup assemblies, respectively.
The first earcup assembly includes a first cushion coupled to an earcup. The first cushion includes a first portion that is acoustically open. The first cushion also includes a second portion acoustically sealed from the first portion.
Apple says that over-ear headphones with closed-back earcups typically provide good sound isolation because they are sealed or substantially sealed off from ambient noise. However, they can also have certain disadvantages due to the closed design of the earcups.
In some closed-back headphones, undesirable or unwanted resonances (e.g., modes) may develop inside a front volume of each respective earcup (e.g., air volume encapsulated inside the earcup or between the earcup and a wearer’s skull and/or ear). What’s more, standing waves can accumulate in the earcups (e.g., between a driver housing plate of the earcup and a wearer’s skull and/or ear) which can degrade sound quality considerably.
As resonance frequency varies between wearers or users (e.g., due to anatomical differences), such unwanted resonance may be difficult to equalize with, for example, a digital signal processor (DSP) or graphic equalizer (EQ). Apple says this is why there’s a need for headphones with improved dampening features, and in particular, passive acoustic dampeners for closed-back, over-ear headphones.
